Wafer Processing Capabilities
UniversityWafer acts as your virtual fab, offering a wide range of processing steps on Silicon, Glass, and III-V materials. We bridge the gap between pure material supply and finished device manufacturing.
Thin Film Deposition
We provide high-quality films for insulation, passivation, and conduction:
- Thermal Oxide: Wet and Dry oxidation (50nm to 2µm).
- LPCVD Nitride: Low-stress Silicon Nitride (Si₃N₄) for MEMS.
- Metal Sputtering: Al, Cu, Ti, Au, Pt, and other custom targets.
Photolithography & Patterning
Our lithography services allow you to define precise features on your substrates without investing in expensive steppers or mask aligners.
- Photoresist Coating: Positive and Negative resists (spin coating).
- Mask Alignment: Contact and proximity alignment for 1µm resolution.
- Etching: RIE (Reactive Ion Etching) and DRIE (Deep RIE) for high aspect ratio structures.
Back-End Processing
Post-fabrication steps are critical for packaging and final device assembly.
- Wafer Thinning: Backgrinding and polishing down to 50µm or less.
- Dicing: Precision saw dicing for separating individual chips/dies.
- Wafer Bonding: Anodic, fusion, and eutectic bonding services.